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| >> Click here to see seminars of
concurrent shows |
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EDLC Development and Application to Vehicle Market | CAR-ELE JAPAN |
| | | | | Date : Jan. 18 (Wed)
11:00 ~ 12:00 Venue : A (East Hall) | | | | | NIPPON CHEMI-CON CORP. |  | | | We will explain the newest development status of Nippon Chemi-Con's EDLC, targetting vehicle market. | |
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UL Safety Standards and Certification Services for EV | EV JAPAN |
| | | | | Date : Jan. 18 (Wed)
13:40 ~ 14:40 Venue : A (East Hall) | | | | | UL JAPAN, INC. | | | | This presentation introduces EV related UL safety standards and certification services provided by UL Group globally. | |
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Power electronics technology and market trends in EV & HEV | CAR-ELE JAPAN |
| | | | | Date : Jan. 19 (Thur)
11:00 ~ 12:00 Venue : A (East Hall) | | | | | YOLE DEVELOPPEMENT | | | | Latest technology evolutions analysis and market forecasts for semiconductor & passive components in the EV/HEV industry | |
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Modling thermal, discharge and aging of Li-ion batteries | CAR-ELE JAPAN |
| | | | | Date : Jan. 19 (Thur)
13:40 ~ 14:40 Venue : A (East Hall) | | | | | KOBELCO RESEARCH INSTITUTE INC. | | | | | |
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CAE utilization of new technologies in the automotive field | CAR-ELE JAPAN |
| | | | | Date : Jan. 19 (Thur)
15:00 ~ 16:00 Venue : A (East Hall) | | | | | ANSYS JAPAN K.K. | | | | | |
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Use of software static analysis for car navigation systems | CAR-ELE JAPAN |
| | | | | Date : Jan. 19 (Thur)
16:20 ~ 17:20 Venue : A (East Hall) | | | | | COVERITY, INC. | | | | | |
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Virtual Development and Verification of ECU Software | CAR-ELE JAPAN |
| | | | | Date : Jan. 20 (Fri)
12:20 ~ 13:20 Venue : A (East Hall) | | | | | ETAS K.K. | | | | A Virtual ECU,which simulates ECU software functions and plant models on a PC,enables the virtual development of SW. | |
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The precision shunt resistor 1m Ohm without any adjustment. | ELE TRADE |
| | | | | Date : Jan. 18 (Wed)
12:20 ~ 13:20 Venue : A (East Hall) | | | | | SYNTEC CORP. | | | | The precision shunt resistors 1m Ohm was realized by precision pressing and ultra-thin outsert molding technology. | |
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spectrometer-mk350 | LIGHTING JAPAN |
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Dev.of Through Glass Via & Transparent cavity glass wafers. | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 18 (Wed)
12:20 ~ 13:20 Venue : D (West Hall) | | | | | TECNISCO, LTD. | | | | Realization of mass-production Through Glass Via and Transparent cavity glass wafer applied to MEMS device, LED-PKG. | |
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SiC, sapphire Wafer & MEMS(TSV,SOI,HWSS) wafer BG and CMP | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 18 (Wed)
13:40 ~ 14:40 Venue : D (West Hall) | | | | | ROKKO ELECTRONICS CO., LTD. | | | | | |
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Amkor Advanced Packaging Technology Roadmap | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 18 (Wed)
13:40 ~ 14:40 Venue : E (West Hall) | | | | | AMKOR TECHNOLOGY JAPAN K.K. | | | | | |
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Quality assurance of electronic components for automobiles. | ELECTROTEST JAPAN |
| | | | | Date : Jan. 18 (Wed)
15:00 ~ 16:00 Venue : A (East Hall) | | | | | OMRON CORP. | | | | | |
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Organic Pattern Inspection System | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 18 (Wed)
15:00 ~ 15:30 Venue : D (West Hall) | | | | | TORAY ENGINEERING CO., LTD. | | | | Organic materials radiate fluorescence when they receive the blue/green light. | |
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NAMICS' Development Policy S.E.E.D.S. and Customer Support | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 18 (Wed)
16:40 ~ 17:10 Venue : D (West Hall) | | | | | NAMICS | | | | Introducing our enhanced analysis technologies, excellent materials for electronic components and great support service. | |
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LED+Reflector technique-the next generation of LED fixtures | LIGHTING JAPAN |
| | | | | Date : Jan. 19 (Thur)
11:00 ~ 12:00 Venue : C (West Hall) | | | | | ALANOD GMBH & CO.KG | | | | The advantages of the LED as a light source have massive influence to the efficiency and comfort of a luminiare. | |
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Failure analyais for Power device | ELE TRADE |
| | | | | Date : Jan. 19 (Thur)
12:20 ~ 13:20 Venue : A (East Hall) | | | | | INTERNATIONAL TEST & ENGINEERING SERVICES CO., LTD. | | | | Typical failure modes and analysis flow are presented. Failure localization methods, EMS and IR-OBIRCH, are highlighted. | |
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spectrometer-mk350 | LIGHTING JAPAN |
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Plastic Molding and SMT for Air Cavity PKG and Exposed PKG | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 19 (Thur)
12:20 ~ 13:20 Venue : D (West Hall) | | | | | ARS ELECTRONICS CO., LTD. | | | | Technical integration of packaging and SMT enhances production solutions (air-cavity, exposed types). | |
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"SUGOWAZA" of the Ehime craftsmanship company | INTERNEPCON JAPAN |
| | | | | Date : Jan. 19 (Thur)
13:40 ~ 14:40 Venue : B (East Hall) | | | | | EHIME ,TOYO INDUSTRIAL CREATIVE CENTER | | | | The technology and the product of a "SUGOWAZA" company which Ehime is proud of are introduced. | |
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Introduction of Chinese LED Industry&HighChem's LED Business | LIGHTING JAPAN |
| | | | | Date : Jan. 19 (Thur)
13:40 ~ 14:40 Venue : C (West Hall) | | | | | HIGHCHEM CO., LTD. | | | | | |
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Amkor Advanced Packaging Technology Roadmap | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 19 (Thur)
13:40 ~ 14:40 Venue : E (West Hall) | | | | | AMKOR TECHNOLOGY JAPAN K.K. | | | | | |
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exhibiting the know-how of success In China | INTERNEPCON JAPAN |
| | | | | Date : Jan. 19 (Thur)
15:00 ~ 16:00 Venue : B (East Hall) | | | | | ASPROVA CORP. | | | | There are difficulties of system fixing.We teach the know-how of 100 factories introduction success in 5years. | |
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Research Center for Three-Dimensional Semiconductors | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 19 (Thur)
16:40 ~ 17:10 Venue : D (West Hall) | | | | | FUKUOKA INDUSTRY, SCIENCE&TECHNOLOGY FOUNDATION | | | | The world-class R&D facility for 3D integration technologies of multiple semiconductors. | |
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Simulation of illumination optics by using ZEMAX | LIGHTING JAPAN |
| | | | | Date : Jan. 20 (Fri)
11:00 ~ 12:00 Venue : C (West Hall) | | | | | PROLINX CORP. | | | | | |
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New generation SPLC (NS Lighting CO,,Ltd) | LIGHTING JAPAN |
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LSI packaging technology of Fujitsu semiconductor group | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 20 (Fri)
12:20 ~ 13:20 Venue : D (West Hall) | | | | | FUJITSU INTEGRATED MICROTECHNOLOGY LTD. | | | | Advanced packaging technology for low profile package and high density package,Flip chip solution | |
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What is special with pure play MEMSfoundry SilexMicrosystems | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 20 (Fri)
12:20 ~ 13:20 Venue : E (West Hall) | | | | | SILEX MICROSYSTEMS | | | | We will introduce you to the manufacturing achievements and proprietary technology of MEMS Foundry Silex Microsystems. | |
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World wide Radio Test & Certificate | ELECTROTEST JAPAN |
| | | | | Date : Jan. 20 (Fri)
13:40 ~ 14:40 Venue : B (East Hall) | | | | | ZACTA TECHNOLOGY CORPORATION CO., LTD. | | | | World wide Radio Test & Certificate. | |
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Introduction of LUMENS LED and Instruction of understanding High performance LED lighting | LIGHTING JAPAN |
| | | | | Date : Jan. 20 (Fri)
13:40 ~ 14:40 Venue : C (West Hall) | | | | | KAMEI CORP. | | | | We will introduce LUMENS LED and help you to choose real high performance LED lighting. | |
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Reflow bonding technology for Semiconductor packaging | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 20 (Fri)
13:40 ~ 14:40 Venue : D (West Hall) | | | | | AYUMI INDUSTRY CO., LTD. | | | | Use of flux-free reflow technology for various packaging processes in semiconductor manufacturing will be explained. | |
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Amkor Advanced Packaging Technology Roadmap | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 20 (Fri)
13:40 ~ 14:40 Venue : E (West Hall) | | | | | AMKOR TECHNOLOGY JAPAN K.K. | | | | | |
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Quality assurance of electronic components for automobiles. | ELECTROTEST JAPAN |
| | | | | Date : Jan. 20 (Fri)
15:00 ~ 16:00 Venue : A (East Hall) | | | | | OMRON CORP. | | | | | |
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Liquid control technology with the latest dispenser | INTERNEPCON JAPAN |
| | | | | Date : Jan. 20 (Fri)
15:00 ~ 16:00 Venue : B (East Hall) | | | | | MUSASHI ENGINEERING INC. | | | | | |
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Mask cleaner with resist removal by chemical is introduced | IC PACKAGING TECHNOLOGY EXPO |
| | | | | Date : Jan. 20 (Fri)
15:00 ~ 15:30 Venue : D (West Hall) | | | | | TECHNOVISION, INC. | | | | Best cleaning performance is introduced as an sample recipe with reist removal step by chemicals. Pictures are shown. | |
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